Products


Tecnair launches new CDUs for data centre cooling
Tecnair, a manufacturer of close control air conditioning units for data centres and a Panasonic company, has introduced a new range of coolant distribution units (CDUs) designed for high-density artificial intelligence and high-performance computing (HPC) data centres. The systems were presented at Data Centre World London 2026, held on 4–5 March, and are intended to support liquid cooling deployments as computing densities increase. Rising AI workloads are pushing rack densities beyond levels typically supported by traditional air cooling. The CDU range has been developed to support liquid cooling architectures, including direct-to-chip and immersion cooling, helping data centre operators manage higher thermal loads. The units are designed for environments where rack densities regularly exceed 50kW and are approaching 100kW. Liquid cooling for high-density infrastructure The CDU range is available in capacities of 400kW and 800kW and can be deployed across a range of environments, from edge facilities to hyperscale data centres. The systems include redundant components such as pumps, power supplies, and sensors to support continuous operation in mission-critical environments. A failover capability is also included to maintain cooling during maintenance or component failure. According to Tecnair, the units can achieve partial power usage effectiveness (pPUE) values as low as 1.02 through the use of free-cooling coils and micro-channel heat exchanger technology. Monitoring functions are integrated through Modbus building management system connectivity, enabling real-time visibility of parameters including temperature, pressure, flow rate, water level, and leak detection. The CDU range is designed to integrate with Panasonic cooling systems, including free-cooling chillers using R1234ze refrigerant with a low global warming potential. These chillers use outside air temperatures, down to -10°C, to generate chilled water through a free-cooling function, supporting improved energy efficiency in suitable climates. For more from Tecnair, click here.

Crestchic unveils 600kW liquid-cooled loadbank
Crestchic, a UK manufacturer of loadbanks and transformers for testing power systems and data centres, has launched its new 600kW Liquid Cooled Loadbank at Data Centre World London 2026, aimed at supporting commissioning in the growing liquid-cooled data centre market. As rack power densities increase, operators are increasingly adopting liquid cooling to manage higher thermal loads. Crestchic says the new system has been designed to provide accurate thermal validation and precision electrical testing for liquid-cooled infrastructure. The 600kW loadbank delivers up to 648kW at 415V and features stable ΔT thermal control to ±0.5°C, enabling repeatable testing during commissioning. Temperature accuracy is maintained regardless of flow variation, while built-in protections cover flow, pressure, overload, underload, and thermal shock. Designed for liquid-cooled data centre commissioning The unit uses a single-vessel architecture, reducing footprint compared with multi-vessel systems at similar power levels. This compact design makes it easier to position in plant rooms and simplifies transport and handling. The platform includes a stackable structure, flush-mounted connections, heavy-duty castors, and dual-side forklift pockets, allowing two units to be transported within a standard-height ISO shipping container. The system integrates with Crestchic’s VCS software, providing live monitoring of supply and hydraulic data, real-time load profiling, and the ability to cluster up to 240 load banks for hybrid air- and liquid-cooled testing. Paul Brickman, Commercial Director at Crestchic, says, “The move towards liquid cooling is accelerating as rack densities increase, particularly with AI and high-performance computing workloads. “Our new 600kW Liquid Cooled Loadbank has been designed from the ground up to serve this market, giving commissioning engineers the precision, reliability, and control they need to bring critical infrastructure online with confidence." The 600kW Liquid Cooled Loadbank is available for sale or rental through Crestchic’s global network. For more from Crestchic, click here.

Kioxia hosts tour of flash memory plant
Memory manufacturer Kioxia has collaborated with Linus Media Group on a video tour of its Yokkaichi Plant in Japan, one of the world’s largest flash memory production facilities. The video, published by Linus Tech Tips, documents a visit to Kioxia Corporation’s manufacturing site, including its flagship Fab 7 facility. The plant operates as a smart factory, with more than three billion data points generated daily from production lines to support AI-driven manufacturing processes. According to the company, the video received nearly one million views within 24 hours of release. https://www.youtube.com/watch?v=ivLvsTnp9fI Inside the Yokkaichi smart factory Presented by Linus Sebastian, the tour follows the process from raw silicon wafers through to finished flash memory and solid state drives. It includes access to wafer and die processing stages before the components become BiCS FLASH 3D flash memory. The video also highlights the facility’s automation systems, process controls, and material handling technologies, as well as the packaging and final testing stages before memory components are assembled into SSDs. Terren Tong, CEO of Linus Media Group, says, “Bringing technology to our viewers is what drives us, and this tour inside Kioxia’s fab gives a rare, up-close look at what goes into the devices we use every day. We really appreciate Kioxia for letting us dive into the manufacturing of cutting-edge flash memory and SSDs.” Paul Rowan, Vice President and Chief Marketing Officer at Kioxia Europe, says, “Our focus at Yokkaichi is on translating innovative engineering into dependable, high-performance storage at scale. "This unique, behind-the-scenes look with Linus Tech Tips allows a wider audience to see the engineering and technology, including our commitment to sustainability that is central to our flash memory and SSD products, while showcasing the latest solutions that power today’s consumer devices and tomorrow’s AI-driven data centres.” For more from Kioxia, click here.

Mayflex to highlight Elevate at Data Centre World 2026
Mayflex, a UK-based distributor of converged IP infrastructure, networking, and electronic security products, will present updates to its Elevate infrastructure portfolio at Data Centre World London 2026, taking place on 4–5 March at ExCeL London. The company will exhibit on Stand B180. Launched at the 2025 event, Elevate brings together fibre connectivity, racks, aisle containment, power distribution, and rack-level security within a single infrastructure platform. Mayflex says the portfolio has evolved over the past 12 months in response to increasing density and performance requirements in data centre environments. Andrew Percival, Managing Director at Mayflex, says, “From concept, our ambition with Elevate was to continually move the offer forwards. "We aim to build an integrated set of solutions that responds to the real pressures facing data centre operators: densification, thermal performance, deployment speed, and operational clarity. The progress made over the last 12 months reflects that focus.” New high-density additions At the exhibition, Mayflex will introduce new very small form factor (VSFF) pre-connectorised fibre systems supporting up to 3,456 fibres in 1U, alongside high-density optical distribution frames with pre-connectorised trays and cables. Additional launches include high-density power distribution strips and intelligent rack locking systems. Updates to the DCR Rack Series and cold aisle containment systems will also be demonstrated. Visitors to Stand B180 can view the portfolio and speak with the team during the event. For more from Mayflex, click here.

How Elevate is redefining data centre infrastructure
It feels like yesterday that Elevate – Future Faster launched at Data Centre World 2025. Since then, the team have been working closely with operators, integrators, and partners to understand where white space designs struggle under pressure, namely: how density is increasing, how airflow and power must evolve, and how programmes need to accelerate without increasing operational risk. Now, as Elevate returns for year two at Data Centre World on Stand B180, it isn’t “new for the sake of new”; it’s a platform that closes the gap between what modern data centres demand and what infrastructure can realistically deliver – more density, more control, and more scale, without complexity creeping in through the back door. Elevate was built as an integrated ecosystem: fibre, racks, aisle containment, power, and security engineered to work together with clean installation, clear labelling, and predictable operation. In its second year, that ecosystem has expanded significantly, with wider choices for high density fibre, more robust airflow strategies, and smarter power and physical security options designed to make scaling easier. Addressing today’s data centre challenges Modern data centres face a familiar set of pressures: rising density, faster change cycles, and tighter operational guardrails. Elevate is designed to help teams keep pace. Densification is no longer optional. Port counts rise, but physical space doesn’t. Elevate’s high-density fibre solutions – VSFF, MPO, and modular ODF architectures – deliver more ports in the same rack unit space while maintaining front access, bend radius control, and clear labelling. The goal isn’t only to fit more, but to manage more. Thermal performance is another sticking point. As loads increase, improvised airflow tactics break down. Elevate’s hot and cold aisle containment is engineered to integrate properly with racks, cable pathways, and power routes. The result is stable airflow separation and higher cooling efficiency across mixed hardware environments. Power, too, needs to evolve. It is no longer enough to energise a rack; operators need visibility, telemetry, and control. Elevate’s high-density intelligent power provides meaningful insight – usage, load, switching – so day two operations become more predictable and less prone to surprises. Deployment speed matters as much as performance. To avoid delays and rework, Elevate prioritises pre-connectorised designs and engineered pathways. Pre-configured fibre assemblies and pre-populated ODF trays reduce on site variability, shorten install windows, and improve “first time right” outcomes. Moreover, as estates grow, clarity becomes critical. Structured labelling, clean patch presentation, and tray level guidance help maintain consistency long after the initial build and far beyond the day one installation. Fast, reliable availability rounds out the approach. Predictable supply chains and standardised configurations help teams maintain design intent and execute programmes without interruption. Advancing the Elevate Platform for 2026 This year, Elevate introduces a number of key additions designed to meet the demands of increasingly dense, increasingly dynamic data centres: 1. VSFF ultra high density pre-connectorised fibre optics deliver far higher port density within standard 1U and 2U panel formats, reducing splicing, test cycles, and deployment time. 2. Hot aisle containment supports facilities optimised around hot air capture and reuse, improving thermal stability as densities rise. 3. High density intelligent power adds the visibility and control required to balance loads, automate switching, and support safe change windows. 4. Intelligent rack locking delivers scalable, auditable access control. 5. High-density ODFs with pre-connectorised trays provide structured, repeatable patching fields with predictable routing and clear documentation. Alongside these additions, the DCR Rack Series, cold aisle containment, and MPO high-density, pre-connectorised solutions return with refinements that make dense builds easier to construct, cool, and maintain. These aren’t isolated features; they’re responses to real operator pressures, helping teams design once, scale confidently, and maintain operational clarity. Experience the Elevate platform at DCW London The most reliable way to evaluate infrastructure is to see the engineering up close. At DCW London, Stand B180, you can explore ODF trays, routing paths, containment interfaces, intelligent power options, and rack level access control, as well as discuss how Elevate can support your growth, densification, or refresh plans for 2026. And while you’re there, enter Elevate’s on-stand competition for a chance to win a pair of Apple AirPods. For more from Elevate, click here.

EXFO launches high fibre count data centre testers
EXFO, a Canadian provider of test, monitoring, and analytics equipment for data centres and telecommunications networks, has introduced a high fibre count data centre testing platform with two new instruments designed for hyperscale and AI infrastructure deployments. The testers will be demonstrated at Data Centre World London 2026 on 4–6 March (Stand B202), alongside a separate showcase at OFC 2026 in Los Angeles on 17–19 March (Booth 523). The release includes two native 24-fibre capable instruments: the FTB-Lite simplex, duplex, and multi-fibre bidirectional certifier, and the PXM/LXM duplex and multi-fibre optical loss test set (OLTS). The equipment is intended to support certification and troubleshooting across large fibre installations in and around data centres. Etienne Gagnon, General Manager Test & Measurement at EXFO, says, “EXFO is trusted by all major hyperscalers to support the accelerated pace of data centre and network builds happening today. “Our high fibre count solution, now reinforced with the only native 24-fibre testers on the market, simplifies testing and enables scaling-up faster to give our customers a competitive advantage as they respond to exponential growth in AI-driven demand.” Testing, certification, and diagnostics The platform supports Tier 1 certification, optical return loss measurement, and Tier 2 troubleshooting across fibre counts up to 24 fibres. Features include automated bidirectional testing, referencing tools, and connector end-face analysis. EXFO says the system is designed to address the increased number of links, connectors, and handling requirements associated with high-density fibre deployments, while reducing the risk of testing errors during large-scale construction projects. For more from EXFO, click here.

Geberit to highlight piping systems at DCW 2026
Swiss manufacturer Geberit will present two supply systems for data centre environments - the Geberit Mapress Stainless Steel and Geberit FlowFit - at Data Centre World 2026 in London, 4–5 March 2026. Geberit Mapress Stainless Steel is designed for long-term operation in demanding conditions. The material’s molybdenum content provides corrosion resistance intended to support continuous operation in critical facilities where downtime must be avoided. Geberit FlowFit focuses on installation efficiency. Its lateral pressing method covers pipe dimensions from d16 to d75 using two pressing jaws, reducing tool changes during installation. Inspection windows and pressing indicators allow installers to verify connections, while fitting geometry maintains flow performance and enables smaller pipe diameters to be used. The company says the two systems are intended to support reliability and consistent performance across modern data centre infrastructure.

Carrier to showcase AI cooling at DCW London 2026
Carrier, a manufacturer of HVAC, refrigeration, and fire and security equipment, will present its QuantumLeap portfolio at Data Centre World London 2026, taking place on 4–5 March. As a Platinum Sponsor, the company will host a panel discussion, a keynote session, and a solo presentation focused on cooling, building management, and lifecycle services for AI-driven data centres. Carrier, part of Carrier Global Corporation, will outline how increasing AI workloads are affecting thermal density and energy consumption across data centre environments. The company says the rapid growth of AI is creating pressure to manage higher heat loads while reducing overall energy use. Its QuantumLeap portfolio includes liquid cooling systems and high-efficiency chillers designed to support next-generation processors and higher rack densities. Integrated management and lifecycle focus Carrier will also highlight its building automation and data centre infrastructure management capabilities. By linking cooling, power, and IT systems through building automation systems and DCIM platforms, the company aims to give operators clearer operational oversight and improved energy control. In addition, Carrier will address lifecycle management, including waste heat reuse and grid participation, as part of broader sustainability strategies within AI data centres. Bertrand Rotagnon, Executive Director Commercial Business Line & Data Centres Europe, says, “Data centres can’t choose between growth, resilience, and energy performance; they need all three. "At DCW London 2026, we’re showcasing Carrier QuantumLeap solutions to help operators simplify decisions, improve efficiency, and move towards measurable energy contribution.” Carrier will be located at Stand D70. The company’s panel discussion takes place at 12:20 on Wednesday, 4 March, with a solo presentation at 15:55 on the same day and a keynote at 14:50 on Thursday, 5 March. For more from Carrier, click here.

AFL: Why data centre leaders are heading to Stand C110
AFL, a manufacturer of fibre optic cables and connectivity equipment, will be attending this year's Data Centre World in London, 4–5 March 2026, exhibiting on Stand C110. In this article, the company tells you about what you can expect: Your AI clusters are hungry for bandwidth. GPU-to-GPU latency is make or break, and you’re being asked to scale yesterday, all while maintaining uptime, managing density, and staying within budget. AFL understands. It has engineered solutions specifically for these problems. What you’ll experience at Stand C110: • Hands-on demos• Industry-first technology• Solutions for your biggest bottlenecks• Modular white space infrastructure you can deploy rapidly• AI-GPU connectivity optimised for ultra-low latency compute fabrics• High-density DCI solutions that maximise available space in cable ducts• Pre-terminated, plug-and-play modules with full traceability to help you deploy faster• Fujikura’s Multi-Core, Hollow-Core, and Mass-Fusion splicers in action – the precision tools that research labs and hyperscalers trust for next-generation fibre deployment• Small-form-factor assemblies – reduce diameter, increase density, maximise airflow and cable pathways• Test with confidence – advanced inspection tools that validate performance before the first packet flows Why AFL for hyperscale data centres? • Globally available — consistent supply chain, wherever you build• Proven reliability — supporting the world’s largest hyperscale networks• Modular and scalable — grow your infrastructure without forklift upgrades• Built for AI workloads — engineered for the bandwidth and latency demands of dense GPU clusters Who should visit the stand? • Network engineers deploying or upgrading DCI links• Data centre architects planning next-generation AI infrastructure• Infrastructure leaders evaluating fibre solutions for hyperscale growth• Operations teams seeking faster commissioning and maintenance workflows Ready to enhance hyperscale efficiency? Bring your toughest connectivity challenges to Stand C110 and see how AFL’s team is already solving the real-world problems you face with innovative solutions ready for immediate global deployment. Find out how its optical fibre experts can help you scale seamlessly across growing hyperscale deployments for AI and cloud. For more from AFL, click here.

Carrier launches CRAH for data centres
Carrier, a manufacturer of HVAC, refrigeration, and fire and security equipment, has introduced the AiroVision 39CV Computer Room Air Handler (CRAH), expanding its QuantumLeap portfolio with a precision cooling system designed for medium- to large-scale data centre environments. Developed and manufactured in Europe, the AiroVision 39CV is intended to support energy efficiency, reliability, and shorter lead times, while meeting EU regulatory requirements. The unit offers a cooling capacity from 20kW to 250kW and is designed to operate with elevated chilled water temperatures. Carrier states that this approach can improve energy performance and contribute to lower power usage effectiveness (PUE) by enabling more efficient chiller operation and supporting free cooling strategies. Factory-integrated design for simplified deployment The AiroVision 39CV features a built-in controller for real-time monitoring, adaptive operation, and integration with building management systems. The control platform can be configured to suit specific operational requirements. All components are factory-integrated to reduce on-site installation and commissioning work. Additional features, including an auto transfer switch and ultra-capacitors, are intended to support service continuity in critical environments. Michel Grabon, EMEA Marketing and Market Verticals Director at Carrier, says, “The 39CV is a strategic addition to our QuantumLeap Solutions portfolio, designed to help data centre operators address today’s most pressing challenges: increasing thermal loads from higher computing densities, the need to reduce energy consumption to meet sustainability targets, and the pressure to deploy solutions quickly and efficiently. "With its high-efficiency design, intelligent control system, and factory-integrated components, the 39CV helps operators to improve energy performance, optimise installation time, and build scalable infrastructures with confidence.” For more from Carrier, click here.



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