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Brady: Make sure all tools are present. Always.

Have you ever arrived at an intervention without the necessary equipment? Ever lost tools during field interventions? How much time do you spend to make sure all equipment is accounted for and present in your vehicles? Thanks to Brady, now you can confirm vehicle inventories digitally and automatically, highlight any missing assets, and home in on misplaced items to quickly complete your vehicles. How much time could you save? Everything present Instantly see which tools are present in a vehicle and what is missing. Easily save substantial time per vehicle and intervention with automated equipment inventory checks that take only seconds. By labelling equipment with passive, battery-free UHF RFID labels, we can let an RFID reader in your vehicle detect which tools and items are present. The RFID reader can check detected tools versus a list of expected items to confirm a complete vehicle inventory or to highlight missing equipment on your phone. Be fully equipped before leaving for a field intervention. Avoid losing tools after interventions. Don’t waste time checking visually where every piece of equipment is. Just scan, get confirmation in seconds, and drive to your next destination. Click here to find out more. For more from Brady, click here.

STL launches 'India's first' hollow core fibre cable

STL, an optical and digital systems company, has introduced a hollow core fibre (HCF) cable in India, designed for data centre networks and high-frequency transmission environments. The development focuses on reducing latency and supporting higher bandwidth demands in modern data centres, hyperscale facilities, and network infrastructure. Unlike conventional optical fibre, which transmits light through a solid glass core, hollow core fibre uses an air-filled core. This allows signals to travel at higher speeds, with STL stating performance improvements of around 46%, alongside reduced latency and signal loss. Noting that it is the first company to develop and manufacture this type of cable in India, STL says it is expanding its optical connectivity portfolio in response to increasing demand from AI-driven and high-performance computing environments. The cable also incorporates a hybrid design intended to support a range of network requirements. This includes hollow core fibre for low-latency transmission, G.654.E fibre for long-distance, low-loss performance, and G.657.A1 fibre to support flexible deployment across different network types. Hybrid design supports varied network needs The hybrid architecture reflects the growing complexity of data centre and telecoms infrastructure, where operators require a mix of performance characteristics within a single cable system. STL reports that the design supports both high-speed data transmission and broader network coverage, particularly in large-scale or distributed environments. The company also states that it holds more than 780 patents and continues to focus on optical technologies aimed at increasing network capacity and efficiency. Badri Gomatam, CTO at STL, says, "Our R&D focus has always been on solving the most complex challenges of the future. With the launch of [this] Hollow Core Fibre cable, we are providing the 'speed-of-light' infrastructure required for the AI revolution. "This is a defining moment that demonstrates our capability to innovate and empower hyperscalers and data centres on a global scale.” For more from STL, click here.

ZutaCore brings two-phase cooling to PCIe GPUs

ZutaCore, a developer of liquid cooling technology, has announced that its OmniTherm cold plate now enables waterless, two-phase cooling for manufacturers building servers with the NVIDIA RTX PRO 6000 Blackwell Server Edition GPUs in a single-slot PCIe form factor, supporting full-power operation in standard enterprise and AI cloud server environments. As AI inference expands across enterprise and cloud environments, PCIe GPU servers have become a common platform due to their relative ease of deployment, scalability, and compatibility with existing infrastructure. However, as GPU power consumption rises, air cooling can become a limiting factor, restricting density, driving up fan power, and increasing the risk of thermal throttling during sustained workloads. The company says OmniTherm addresses this by enabling a transition to two-phase liquid cooling without introducing water inside the server. The single-slot design allows operators to increase accelerator density in standard server architectures while capturing heat into a liquid loop, reducing reliance on high fan speeds that can create excessive noise, waste power, and cause difficult operating conditions in the data centre. "Enterprise and cloud operators want the flexibility of PCIe GPUs, but they also need density and sustained performance as power levels rise," comments My D. Truong, CTO of ZutaCore. "OmniTherm delivers waterless, two-phase cooling in a single-slot form factor, helping data centres increase accelerator density while maintaining stable thermals for 24/7 AI workloads." Two-phase cooling for dynamic AI workloads Production AI workloads - particularly inference - are rarely steady, fluctuating constantly and creating thermal swings that can affect performance and reliability. ZutaCore says its two-phase approach is designed to respond to changing workloads, helping data centres maintain predictable performance under dynamic utilisation. As racks move into higher power levels, the operational cost of air cooling also rises, with increased fan energy consumption and growing acoustic and facility pressures. OmniTherm uses a sealed, non-conductive dielectric fluid system that captures heat without requiring facility water in the server, reducing cooling overhead and providing a path to scaling PCIe-based AI deployments. Alongside this announcement, ZutaCore has also introduced HyperCool Cloud, a cloud-native operations platform designed to help data centres manage liquid cooling infrastructure. The platform, the company says, provides "near-real-time" CDU telemetry, fleet-level monitoring, and alarm-to-resolution workflows, helping operators manage service response and uptime as deployments scale across sites and fleets. For more from ZutaCore, click here.

ZIEHL-ABEGG updates ZAplus fan design

ZIEHL-ABEGG, a German ventilation manufacturer, has introduced the ZAplus Next Generation axial fan, aimed at improving airflow, efficiency, and acoustic performance in data centres and other cooling applications. The updated design builds on the existing ZAplus platform, incorporating a slimmer housing and revised aerodynamic components to increase air output and pressure within the same footprint. The company says this allows larger fan sizes to be deployed in existing spaces, supporting upgrades without requiring significant changes to system layouts. The housing, available in sizes from 450 mm to 1,000 mm, has been developed using computational fluid dynamics to optimise airflow. It is manufactured using plastic injection moulding to reduce weight and improve corrosion resistance. Design changes focus on airflow and efficiency The system includes FE2owlet and FE3owlet blade designs, alongside guide vanes and a compact diffuser to stabilise airflow and improve pressure performance. Additional nozzles are used to help smooth airflow and reduce turbulence. The company notes that these elements are designed to support efficient operation while maintaining a consistent footprint. The fan also enables variable speed control, allowing airflow to be adjusted to demand, which can help reduce energy use over time. The ZAplus Next Generation is available with both AC and ECblue motor options, providing flexibility for both retrofit and new-build data centre environments. ZIEHL-ABEGG says its composite construction is intended to support durability and reduce maintenance requirements in long-term operation.

Corning expands AI data centre connectivity

Corning, a US manufacturer of optical fibre for telecommunications and data centres, has expanded its data centre connectivity portfolio through a licensing agreement with US Conec. The agreement enables Corning to use PRIZM TMT optical ferrule technology, designed to increase fibre density within data centre environments, particularly for AI infrastructure. The technology supports higher fibre counts in limited space, addressing growing demand for connectivity as AI workloads scale and data centre architectures evolve. Mike O’Day, Senior Vice President and General Manager of Corning Optical Communications, comments, “AI infrastructure is pushing optical connectivity into new and more demanding environments. “By licensing PRIZM TMT, Corning is strengthening its ability to deliver scalable, fibre-rich solutions that help customers build larger, faster, and more efficient AI clusters, while aligning closely with the broader industry ecosystem.” Supporting higher-density AI infrastructure As AI deployments expand, data centres are increasing the number of connected accelerators and shifting towards optical connections in place of traditional copper links. This change is driving higher fibre density within server and switch racks, increasing the need for compact, high-performance connectors. The PRIZM TMT ferrule uses expanded beam technology with precision-aligned microlenses, rather than direct fibre contact. This approach is intended to improve installation reliability, reduce sensitivity to contamination, and support faster deployment. According to the companies, these characteristics are suited to large-scale AI environments, where high connection density and consistent performance are required. For more from Corning, click here.

NetApp launches new EF-Series storage systems

NetApp, a US provider of data storage and cloud infrastructure management, has announced new additions to its EF-Series storage portfolio, designed for high-performance workloads across AI, high-performance computing (HPC), and transactional databases. The latest models, EF50 and EF80, are intended to support increasing data demands in enterprise environments, including emerging applications such as sovereign AI clouds and AI-driven manufacturing. The systems are designed to work with parallel file systems such as Lustre and BeeGFS, supporting HPC simulations and GPU-intensive workloads through high-performance scratch storage. Performance and efficiency improvements According to NetApp, the new systems deliver over 110GBps of read throughput and 55GBps of write throughput, representing a 250% increase compared to previous generations. The systems also offer a power efficiency of 63.7GBps per kW, alongside storage density of up to 1.5PB within a 2U form factor. This is intended to support high-performance requirements while maintaining efficient rack usage. The EF-Series is positioned to support a range of use cases, including AI development, media production workflows, and large-scale data processing, with built-in data protection features. Clayton Vipond, Senior Solution Architect at CDW, says, “As we navigate the AI era, many enterprises are finding that they need to maximise their raw performance to extract the most value from their data. “The refreshed NetApp EF-Series deliver the throughput and capacity businesses need to scale high-powered workloads that transform data into insights and outcomes.” Simon Robinson, Principal Analyst at Omdia, adds, “By delivering a high-performance storage system that supports parallel file systems like Lustre and BeeGFS, NetApp is making its mark as emerging industries - such as neocloud - emerge to support the AI-Era.” NetApp states that the EF-Series platform builds on its existing installed base, with more than one million deployments globally. For more from NetApp, click here.

Panduit expands fibre portfolio with fusion splice connectors

Panduit, a manufacturer of electrical and network infrastructure solutions, has introduced OmniSplice, a new range of fusion-spliced fibre optic connectors designed for data centres, edge environments, and enterprise networks. The addition expands the company’s fibre optic portfolio with connectors aimed at supporting high-performance connectivity and faster installation in modern network infrastructure. OmniSplice connectors are designed for use with standard fusion splicing equipment, allowing integration into existing installation and maintenance workflows without requiring additional tools or modifications. Panduit says the connectors are intended to support consistent performance while reducing installation time. Integrated design for simplified deployment A key feature of the OmniSplice range is the integration of the splice point within the connector housing. This removes the need for additional components such as pigtails, helping to reduce space requirements and simplify installation. The connectors include pre-assembled fibre stubs and a holder design intended to support the fusion splicing process, aiming to improve consistency and reduce the likelihood of installation errors. According to Panduit, the design is suited to environments where rapid deployment or maintenance is required, including moves, adds, and changes, as well as repair work under time constraints. The launch reflects continued growth in fibre optic infrastructure across data centres, enterprise LANs, and edge applications, where there is increasing demand for solutions that can be integrated efficiently into existing systems. For more from Panduit, click here.

DSE delivers data centre energy resilience

Deep Sea Electronics (DSE), a UK-based manufacturer with over 50 years of engineering expertise, delivers advanced paralleling and ATS controllers ideally suited to the demanding requirements of modern data centre environments. In facilities where uptime is critical and resilience is non-negotiable, DSE solutions provide precise control, seamless synchronisation, and dependable automatic transfer between mains and standby power sources. Designed and manufactured in the UK, DSE’s advanced paralleling controllers enable reliable load sharing, complex multi set configurations, and fast, stable response to load changes. Complementing this, its ATS controllers ensure smooth and accurate mains failure detection and transfer, minimising risk and protecting critical infrastructure. With robust monitoring, clear diagnostics, and flexible communications integration, DSE systems support full visibility and control across standby power architectures. Backed by global technical support and long-term product availability, DSE provides data centre operators with trusted technology that strengthens energy resilience and safeguards operational continuity.

Keysight expands validation for 1.6T AI DC interconnects

Keysight Technologies, a manufacturer of electronic test and measurement equipment and software, has introduced the Functional Interconnect Test Solutions (FITS) portfolio, alongside the first product in the range, FITS-8CH, designed to validate digital-layer error performance for high-speed optical and copper interconnects used in network infrastructure. The platform provides bit error ratio (BER) and forward error correction (FEC) validation for interconnect technologies supporting modern ethernet architectures, including 400GE, 800GE, and emerging 1.6T deployments. As interconnect speeds increase and designs become more complex, manufacturers of chips, interconnects, and networking equipment face greater pressure to ensure reliability before mass production and during manufacturing. While traditional physical-layer test tools validate electrical lanes against industry specifications, system-level testing provides additional insight into how fully integrated interconnect assemblies perform under operational conditions. Digital-layer testing for high-speed interconnects The FITS-8CH platform provides multi-lane error performance validation at the digital layer, supporting PAM4 signalling speeds from 53Gb/s to 212.5Gb/s. The system enables simultaneous bi-directional testing across eight transmit and eight receive channels, allowing complete optical or copper interconnect assemblies to be validated during development, manufacturing, and system-level qualification. The platform also integrates with Keysight’s physical-layer testing systems, enabling validation across a broader range of network configurations and topologies. According to the company, the platform includes automated lane-by-lane tuning to optimise PAM4 signal output and improve measurement consistency. This capability can help identify potential manufacturing or configuration issues earlier in the process, including mechanical misalignment, thermal failures, or incorrect digital signal processor settings. Keysight says the FITS portfolio is intended to support testing requirements across the full product lifecycle, from research and development through to production and deployment in large-scale network environments. For more from Keysight, click here.

Legrand's UPS wins Data Centre World award

French multinational infrastructure products manufacturer Legrand’s Keor FLEX modular uninterruptible power supply (UPS) has won the Best Reuse or Recycling of Products, Energy, or Data Centre Infrastructure category at the Data Centre World Awards 2026. The award was presented during Data Centre World London, held on 4–5 March at ExCel London, and recognises projects and technologies that support resource reuse, waste reduction, and improved sustainability across the data centre sector. Keor FLEX was recognised for its modular architecture and design approach aimed at extending the operational lifespan of critical power infrastructure. Modular design focused on lifecycle extension Unlike traditional UPS systems that require replacement of the entire unit at the end of its lifecycle, the Keor FLEX system allows individual power or bypass modules to be replaced or refurbished independently. The system uses a hot-swappable modular design, allowing capacity to be expanded or maintained without taking the entire system offline. According to Legrand, the system achieves 98.6% efficiency in online double conversion mode and more than 99% efficiency in ECO mode. It also has an 85% recyclability rate under IEC/TR 62635, with more than 69% recyclable metal content and packaging that includes 50% recycled material. The UPS integrates silicon carbide technology and a low-impedance internal busbar architecture, designed to reduce thermal stress on components and extend the lifespan of power modules. Keor FLEX also supports a universal battery interface that allows existing VRLA, lithium-ion, or nickel-zinc battery systems to be retained during upgrades. Marc Marazzi, Vice President at Legrand Data Center Solutions Europe, says, “Data centres are under pressure to deliver more compute power while reducing environmental impact. “Keor FLEX proves that sustainability and performance are not mutually exclusive. By designing circularity into the core architecture, we’ve created a UPS platform that extends asset life, reduces waste, lowers energy consumption, and supports evolving AI workloads - all while improving total cost of ownership. This reflects Legrand’s broader sustainability commitments, including being awarded an ‘A’ rating by CDP for the second consecutive year.” The system is designed to scale from 100kW to 1.2MW per frame, with up to 4.8MW available in parallel configurations for larger data centre environments. For more from Legrand, click here.