Enterprise Network Infrastructure: Design, Performance & Security

Barriers to colocation could hold back DC market

Speaking from the Space Comm Expo Europe event in London, Strategies in Satellite Ground Segment (SSGS), the organiser of the world’s only conference dedicated exclusively to the satellite ground segment, has warned that the global success of data centres is at risk if barriers to their colocation with satellite ground stations are not removed. SSGS argues that the advantages to placing a satellite ground station next to a data centre are already clear. It suggests that, for example, keeping the antenna systems physically close to compute and storage functions eliminates long terrestrial backhaul links and helps to reduce latency. Both the data centre and ground station can benefit from cost-savings and can become scalable digital hubs as capacity can be quickly added to meet increased demand. However, securing the necessary planning permissions, obtaining sufficient levels of funding, obtaining the necessary spectrum licenses in already crowded frequency bands, and event issues relating to data sovereignty can all hold up the process of colocation. Colocating data centres with satellite ground systems Kevin French, Director of the SSGS conference and exhibition, says, “Satellite ground systems are increasingly being colocated with data centres, and it’s not a coincidence; it’s a structural shift. "As demand for high-capacity, low-latency services accelerate, bringing ground infrastructure closer to compute isn’t just efficient; it’s transformative. “Colocation enables virtualised architectures, cloud native workflows, and far more resilient end-to-end operations. It ensures that satellite data isn’t just collected, but processed, stored, and delivered with the speed and reliability that modern networks now require.” While there are successful colocation projects in operation - such as the recent approval given to Amazon's Project Kuiper to operate a satellite earth station gateway at the National Space Centre (NSC) in Cork, Ireland - there are fears that the speed of approvals in some jurisdictions could lag behind demand and create a two-tier system. The issue of colocation, data centres, cloud, and edge computing is set to be a major topic of discussion at the SSGS conference being held at the Park Plaza Hotel in London on 30 September 2026. Registration is now open. Find out more by clicking here.

Keysight expands validation for 1.6T AI DC interconnects

Keysight Technologies, a manufacturer of electronic test and measurement equipment and software, has introduced the Functional Interconnect Test Solutions (FITS) portfolio, alongside the first product in the range, FITS-8CH, designed to validate digital-layer error performance for high-speed optical and copper interconnects used in network infrastructure. The platform provides bit error ratio (BER) and forward error correction (FEC) validation for interconnect technologies supporting modern ethernet architectures, including 400GE, 800GE, and emerging 1.6T deployments. As interconnect speeds increase and designs become more complex, manufacturers of chips, interconnects, and networking equipment face greater pressure to ensure reliability before mass production and during manufacturing. While traditional physical-layer test tools validate electrical lanes against industry specifications, system-level testing provides additional insight into how fully integrated interconnect assemblies perform under operational conditions. Digital-layer testing for high-speed interconnects The FITS-8CH platform provides multi-lane error performance validation at the digital layer, supporting PAM4 signalling speeds from 53Gb/s to 212.5Gb/s. The system enables simultaneous bi-directional testing across eight transmit and eight receive channels, allowing complete optical or copper interconnect assemblies to be validated during development, manufacturing, and system-level qualification. The platform also integrates with Keysight’s physical-layer testing systems, enabling validation across a broader range of network configurations and topologies. According to the company, the platform includes automated lane-by-lane tuning to optimise PAM4 signal output and improve measurement consistency. This capability can help identify potential manufacturing or configuration issues earlier in the process, including mechanical misalignment, thermal failures, or incorrect digital signal processor settings. Keysight says the FITS portfolio is intended to support testing requirements across the full product lifecycle, from research and development through to production and deployment in large-scale network environments. For more from Keysight, click here.

STMicroelectronics begins silicon photonics production for AI

STMicroelectronics (ST), a Swiss-Italian semiconductor manufacturer, has begun high-volume production of its silicon photonics platform designed for optical interconnects in data centres and artificial intelligence infrastructure. The company’s PIC100 platform is used in optical transceivers deployed by hyperscale operators to support high-speed connectivity within data centres and AI clusters. The 800G and 1.6T transceivers are intended to support increasing bandwidth requirements while reducing latency and energy consumption. Production is being carried out on 300mm semiconductor manufacturing lines, which the company says allow the platform to be produced at scale as demand for AI infrastructure grows. Fabio Gualandris, President of Quality, Manufacturing and Technology at STMicroelectronics, says, “Following the announcement of its new silicon photonics technology in February 2025, ST is now entering high-volume production for leading hyperscalers. "The combination of our technology platform and the superior scale of our 300mm manufacturing lines gives us a unique competitive advantage to support the AI infrastructure super-cycle. “Looking ahead, we are planning and executing on capacity expansions to enable more than quadrupling of production by 2027. This fast expansion is fully underpinned by customers’ long-term capacity reservation commitments.” Silicon photonics technology for optical interconnects Silicon photonics technology combines optical and electronic components to enable high-speed data transmission between servers, switches, and other computing infrastructure. According to market research firm LightCounting, the data centre pluggable optics market reached $15.5 billion (£11.5 billion) in 2025 and is expected to grow at a compound annual growth rate of 17% between 2025 and 2030. Vladimir Kozlov, CEO and Chief Analyst at LightCounting, says, “The data centre pluggable optics market continues to expand strongly, reaching $15.5 billion (£11.5 billion) in 2025. We expect the market to grow at a compound annual growth rate (CAGR) of 17% from 2025 through 2030, surpassing $34 billion (£25.3 billion) by the end of the forecast period. In addition, co-packaged optics (CPO) will emerge as a rapidly growing segment, contributing more than $9 billion (£6.7 billion) in revenue by 2030. Over the same period, the share of transceivers incorporating silicon photonics modulators is projected to increase from 43% in 2025 to 76% by 2030. “ST’s leading silicon photonics platform coupled with its aggressive capacity expansion plan illustrates its capabilities to provide hyperscalers with secure, long-term supply, predictable quality, and manufacturing resilience.” STMicroelectronics is also developing the next stage of its silicon photonics roadmap with the PIC100 TSV platform. This technology will integrate through-silicon via connections to increase optical connectivity density, improve module integration, and support system-level thermal efficiency. The platform is designed to support emerging architectures such as near packaged optics and co-packaged optics, which aim to bring optical connectivity closer to processing hardware within large-scale computing systems. The company will present further updates on its silicon photonics technology at the Optical Fiber Communication Conference in Los Angeles, USA, between 15 and 19 March 2026.

Huawei launches enhanced AI-centric network solutions

Chinese multinational technology company Huawei released a series of all-scenario U6 GHz products at MWC Barcelona 2026 to help carriers unlock the full potential of 5G-A and set the stage for a seamless transition to 6G. The company also launched enhanced AI-centric network solutions that will help carriers prepare for the agentic era by enabling intelligent services, networks, and network elements (NEs). In addition, Huawei is showcasing its SuperPoD cluster for the first time outside China, which they have created to offer "a new option for the intelligent world". The theme of Huawei's booth for this year's conference is "Advancing All Intelligence", reflecting the company's plans to build more AI-centric networks and computing backbones that will help carriers and industry customers seize opportunities from the AI era. U6 GHz: Unlocking 5G-A potential for a smooth transition to 6G According to Huawei, the next five years will provide a window of opportunity to unleash the full potential of 5G-A. They plan to work with global carriers on the large-scale 5G-A deployment, use high uplink to address surging consumer and industry demand for mobile AI applications, and use the U6 GHz band to unlock the full value of spectrum and pave the way for smooth evolution to 6G. There are already 70 million 5G-A users globally and 5G-A is increasingly being adopted by carriers at scale. In China, Huawei has helped carriers deliver contiguous 5G-A coverage across 270 cities and launch 5G-A packages that monetise experience in over 30 provinces. The all-scenario U6 GHz products and solutions Huawei have released use innovative technologies to create a high-capacity, low-latency, optimal-experience backbone designed for mobile AI applications. Three-layer intelligence with AI-centric network: Seizing opportunities in the agentic era Following the trend to integrate AI directly into networks, Huawei is using AI to create AI-centric network solutions that will act as target networks for the agentic era. These solutions embed intelligence across three layers: • At the service layer — Huawei is helping carriers build multi-agent collaboration platforms, with specialised agents for calling, experience monetisation, and home broadband. These platforms will enable AI-driven transformation of carriers' core services like voice, internet access, and home broadband. • At the network layer — Phase one of Huawei's L4 Autonomous Driving Network (AND L4) solution primarily focuses on single-scenario automation, helping carriers drastically improve O&M efficiency, network quality, and monetisation capabilities. By the end of 2025, the company's single-scenario ADN solutions have been commercially deployed on more than 130 telecom networks worldwide. Moving forward, Huawei will continue to help carriers reshape operations with AI, going beyond single-scenario automation to support end-to-end single-domain network autonomy. • At the NE layer — Huawei works with carriers to accelerate innovation in areas like algorithm optimisation for RANs, intelligent and accurate service identification for WANs, and unified service intent for core networks that helps integrate B2C and B2H services. Innovations in these domains are already driving marked improvements in network energy and spectral efficiency, intelligent service awareness, and network resilience assurance. Computing backbone with SuperPoDs and clusters: A new option for the intelligent world In the computing space, Huawei is showcasing its computing cluster and SuperPoD products featuring new innovations in system-level architecture, including its UnifiedBus technology for SuperPoD interconnect, for the first time outside China. Key products on display will include the Atlas 950 SuperPoD for AI computing, the TaiShan 950 SuperPoD for general-purpose computing, the Atlas 850E SuperPoD, and the TaiShan 500 and TaiShan 200 servers. These offerings are Huawei's answer to demand for stronger compute and lower latency – two elements that are especially critical as trillion-parameter AI models become more commonplace and agentic AI is introduced into core production systems. These offerings also reflect Huawei's ongoing commitment to going fully open source and open access. The company is actively working with partners to build an open computing ecosystem and provide the world with another option for solid computing power. In the enterprise space, Huawei's focus at MWC is on helping different industries accelerate their intelligent transformation. Together with customers, partners, and representatives from different industries, Huawei will unveil a series of innovative practices that are helping different industries go intelligent on all fronts. The company will also share its new offerings in digital and intelligent infrastructure, and give updates on its latest efforts in partner ecosystem development. In total, Huawei will feature 115 industrial intelligence showcases for enterprise customers in different domains, its SHAPE 2.0 Partner Framework, and 22 new industrial intelligence solutions jointly developed with partners. In the consumer space, Huawei's theme for this year's MWC is "Now is Yours". The company is working to deliver an unparalleled intelligent experience for consumers in all scenarios and will showcase a range of new smartphones, wearables, tablets, PCs, and earphones that feature its latest breakthroughs in areas like foldable screens, health and fitness, mobile photography, productivity, and creativity. In 2026, Huawei will keep innovating to deliver competitive products with a superior experience, giving consumers greater freedom to discover and create in their own unique way. Huawei also announced that it had successfully surpassed the commitment it had made to help drive digital inclusion and combat the rapidly widening digital divide. By the end of 2025, Huawei had worked with customers to provide connectivity to 170 million people in remote areas across more than 80 countries, giving more people access to inclusive digital services. MWC Barcelona 2026 is being held from 2 March to 5 March in Barcelona, Spain. During the event, Huawei is showcasing its latest products and solutions at Stand 1H50 in Fira Gran Via Hall 1. The era of agentic networks is now approaching fast and the commercial adoption of 5G-A at scale is gaining speed. Huawei is actively working with carriers and partners around the world to unleash the full potential of 5G-A and pave the way for the evolution to 6G. It is also creating AI-centric network solutions to enable intelligent services, networks, and network elements (NEs), speeding up the large-scale deployment of level-4 autonomous networks (AN L4) and using AI to upgrade its core business. Together with other industry players, it says it will create leading value-driven networks and AI computing backbones for a fully intelligent future. For more information, click here to visit Huawei's website. For more from Huawei, click here.

Nokia, Telefónica to expand edge networking in Spain

Finnish telecommunications company Nokia has been selected by Telefónica, a Spanish multinational telecommunications company, to deploy networking technology across 17 new edge data centre nodes in Spain. The rollout forms part of Telefónica’s expansion of distributed edge infrastructure, supporting AI, B2B, and telco cloud services for residential, enterprise, and public sector users. Nokia will provide connectivity for compute and storage within each edge facility, as well as links between the sites and external networks. The infrastructure is designed to support AI training and inferencing closer to end users, alongside digital services in healthcare, education, industry, and government. Under the multi-year agreement, Nokia has exclusive responsibility for networking across the 17 nodes. 12 have already been deployed, including at Telefónica’s Tecno-Alcalá site. Multi-year agreement covers 17 edge nodes The latest phase follows a pilot deployment of three edge data centres in 2024. Nokia now acts as sole networking technology partner for the programme, with the companies stating that a single-vendor approach is intended to simplify operations and standardise architecture. Sergio Sánchez, CTIO at Telefónica España, comments, “This initiative fully aligns with our strategy to make edge cloud and artificial intelligence main cornerstones of Telefónica’s growth. "Nokia has proven to be a trusted connectivity partner in this mission, and they are playing a critical role in building secure, reliable data centre networks for our ambitious edge node project. "Through this effort, we are not only enhancing our digital infrastructure but also reinforcing Spain’s technological sovereignty and enabling a more dynamic, user-centric digital ecosystem.” David Heard, President, Network Infrastructure at Nokia, adds, “We are proud to collaborate with Telefónica for this landmark project that supports our customer’s shift to a nationwide distributed edge architecture. "This win underscores our long-term strategic relationship and Nokia’s leadership in building AI-ready, high-performance data centre networking solutions. Together, we’re creating the foundation for Spain’s digital future, bringing intelligence and services closer to where people and businesses need them most.” For more from Nokia, click here.

STL, Mynet deliver fibre in mountainous Italy

STL, an optical and digital systems company, has worked with Mynet to deliver optical fibre infrastructure for the Intacture data centre in Trentino, Italy, located in a mountainous area described as the ‘heart of the mountain’. The project was led by the University of Trento as implementing body and scientific lead. It involves total funding of €50.2 million (£43.7 million), including €18.4 million (£16 million) from Italy’s National Recovery and Resilience Plan (PNRR). Mynet, a telecommunications company focused on fibre optic networks across Northern Italy, is the first provider to activate fibre connectivity at the facility. The deployment required high-capacity fibre to be installed within a tight timeframe and in a geographically complex environment. https://www.youtube.com/watch?v=9KpsqOIWu2E Fibre deployment completed within two months STL supplied high fibre-count cable with a compact diameter, designed for installation in 10/12mm duct systems. The cable is engineered to support long-distance blowing, faster end preparation, and simplified on-site handling, while meeting performance, durability, and scalability requirements. The connectivity infrastructure assigned to Mynet was completed in under two months. According to the companies, this resulted in around a 50% reduction in deployment time, an expected network lifetime of more than 15 years, and improved stability during peak load. Giovanni Zorzoni, General Manager of Mynet, says, “We accepted a challenge to bring high-performance connectivity to this extraordinary infrastructure in less than sixty days. "With STL’s advanced optical fibre solutions, we were able to focus on the design and execution without compromising on reliability or performance. The quality, robustness, and ease of deployment of STL’s optical fibre solutions enabled us to complete the project at record speed, even in a uniquely demanding environment.” Rahul Puri, CEO, ONB, STL, adds, “This collaboration underscores STL's expertise in delivering mission-critical digital infrastructure for data centres. "By providing scalable, future-ready solutions like multi-core and low-latency fibre, we are helping our customers build resilient networks structurally prepared for an AI-driven future.” For more from STL, click here.

Mayflex to highlight Elevate at Data Centre World 2026

Mayflex, a UK-based distributor of converged IP infrastructure, networking, and electronic security products, will present updates to its Elevate infrastructure portfolio at Data Centre World London 2026, taking place on 4–5 March at ExCeL London. The company will exhibit on Stand B180. Launched at the 2025 event, Elevate brings together fibre connectivity, racks, aisle containment, power distribution, and rack-level security within a single infrastructure platform. Mayflex says the portfolio has evolved over the past 12 months in response to increasing density and performance requirements in data centre environments. Andrew Percival, Managing Director at Mayflex, says, “From concept, our ambition with Elevate was to continually move the offer forwards. "We aim to build an integrated set of solutions that responds to the real pressures facing data centre operators: densification, thermal performance, deployment speed, and operational clarity. The progress made over the last 12 months reflects that focus.” New high-density additions At the exhibition, Mayflex will introduce new very small form factor (VSFF) pre-connectorised fibre systems supporting up to 3,456 fibres in 1U, alongside high-density optical distribution frames with pre-connectorised trays and cables. Additional launches include high-density power distribution strips and intelligent rack locking systems. Updates to the DCR Rack Series and cold aisle containment systems will also be demonstrated. Visitors to Stand B180 can view the portfolio and speak with the team during the event. For more from Mayflex, click here.

RETN launches Tallinn–Cēsis backbone route

RETN, an independent global network services provider, has launched a new backbone route between Tallinn and Cēsis, designed to strengthen connectivity between Northern and Central Europe. The route was tested shortly before entering service when a fibre break affected the primary backbone path in late 2025. During pre-service testing, engineers redirected live traffic onto the new Tallinn–Cēsis link. More than 40 DWDM (Dense Wavelength Division Multiplexing) backbone channels across multiple European segments were rerouted within 60 minutes. According to the company, latency and jitter remained within normal operating parameters during the transfer. Additional capacity and route diversity The new line forms part of RETN’s wider network expansion strategy, aimed at increasing route and supplier diversity. It provides an additional terrestrial path between Finland, the Nordics, and Central Europe. The deployment includes a new core point of presence at Greenergy Data Centre in Tallinn and adds capacity of up to 40Tbps, with additional DWDM spectrum available for future services and traffic resilience. Tony O’Sullivan, CEO of RETN, says, “Modern backbone networks have to be engineered on the assumption that outages are inevitable. Therefore, the network design should be resilient from the start. "The Tallinn–Cēsis route was built as part of a deliberate resilience strategy, adding diversity at both the route and supplier level so that when a failure occurs, traffic can be shifted quickly without compromising performance.” For more from RETN, click here.

How Elevate is redefining data centre infrastructure

It feels like yesterday that Elevate – Future Faster launched at Data Centre World 2025. Since then, the team have been working closely with operators, integrators, and partners to understand where white space designs struggle under pressure, namely: how density is increasing, how airflow and power must evolve, and how programmes need to accelerate without increasing operational risk. Now, as Elevate returns for year two at Data Centre World on Stand B180, it isn’t “new for the sake of new”; it’s a platform that closes the gap between what modern data centres demand and what infrastructure can realistically deliver – more density, more control, and more scale, without complexity creeping in through the back door. Elevate was built as an integrated ecosystem: fibre, racks, aisle containment, power, and security engineered to work together with clean installation, clear labelling, and predictable operation. In its second year, that ecosystem has expanded significantly, with wider choices for high density fibre, more robust airflow strategies, and smarter power and physical security options designed to make scaling easier. Addressing today’s data centre challenges Modern data centres face a familiar set of pressures: rising density, faster change cycles, and tighter operational guardrails. Elevate is designed to help teams keep pace. Densification is no longer optional. Port counts rise, but physical space doesn’t. Elevate’s high-density fibre solutions – VSFF, MPO, and modular ODF architectures – deliver more ports in the same rack unit space while maintaining front access, bend radius control, and clear labelling. The goal isn’t only to fit more, but to manage more. Thermal performance is another sticking point. As loads increase, improvised airflow tactics break down. Elevate’s hot and cold aisle containment is engineered to integrate properly with racks, cable pathways, and power routes. The result is stable airflow separation and higher cooling efficiency across mixed hardware environments. Power, too, needs to evolve. It is no longer enough to energise a rack; operators need visibility, telemetry, and control. Elevate’s high-density intelligent power provides meaningful insight – usage, load, switching – so day two operations become more predictable and less prone to surprises. Deployment speed matters as much as performance. To avoid delays and rework, Elevate prioritises pre-connectorised designs and engineered pathways. Pre-configured fibre assemblies and pre-populated ODF trays reduce on site variability, shorten install windows, and improve “first time right” outcomes. Moreover, as estates grow, clarity becomes critical. Structured labelling, clean patch presentation, and tray level guidance help maintain consistency long after the initial build and far beyond the day one installation. Fast, reliable availability rounds out the approach. Predictable supply chains and standardised configurations help teams maintain design intent and execute programmes without interruption. Advancing the Elevate Platform for 2026 This year, Elevate introduces a number of key additions designed to meet the demands of increasingly dense, increasingly dynamic data centres: 1. VSFF ultra high density pre-connectorised fibre optics deliver far higher port density within standard 1U and 2U panel formats, reducing splicing, test cycles, and deployment time. 2. Hot aisle containment supports facilities optimised around hot air capture and reuse, improving thermal stability as densities rise. 3. High density intelligent power adds the visibility and control required to balance loads, automate switching, and support safe change windows. 4. Intelligent rack locking delivers scalable, auditable access control. 5. High-density ODFs with pre-connectorised trays provide structured, repeatable patching fields with predictable routing and clear documentation. Alongside these additions, the DCR Rack Series, cold aisle containment, and MPO high-density, pre-connectorised solutions return with refinements that make dense builds easier to construct, cool, and maintain. These aren’t isolated features; they’re responses to real operator pressures, helping teams design once, scale confidently, and maintain operational clarity. Experience the Elevate platform at DCW London The most reliable way to evaluate infrastructure is to see the engineering up close. At DCW London, Stand B180, you can explore ODF trays, routing paths, containment interfaces, intelligent power options, and rack level access control, as well as discuss how Elevate can support your growth, densification, or refresh plans for 2026. And while you’re there, enter Elevate’s on-stand competition for a chance to win a pair of Apple AirPods. For more from Elevate, click here.

EXFO launches high fibre count data centre testers

EXFO, a Canadian provider of test, monitoring, and analytics equipment for data centres and telecommunications networks, has introduced a high fibre count data centre testing platform with two new instruments designed for hyperscale and AI infrastructure deployments. The testers will be demonstrated at Data Centre World London 2026 on 4–6 March (Stand B202), alongside a separate showcase at OFC 2026 in Los Angeles on 17–19 March (Booth 523). The release includes two native 24-fibre capable instruments: the FTB-Lite simplex, duplex, and multi-fibre bidirectional certifier, and the PXM/LXM duplex and multi-fibre optical loss test set (OLTS). The equipment is intended to support certification and troubleshooting across large fibre installations in and around data centres. Etienne Gagnon, General Manager Test & Measurement at EXFO, says, “EXFO is trusted by all major hyperscalers to support the accelerated pace of data centre and network builds happening today. “Our high fibre count solution, now reinforced with the only native 24-fibre testers on the market, simplifies testing and enables scaling-up faster to give our customers a competitive advantage as they respond to exponential growth in AI-driven demand.” Testing, certification, and diagnostics The platform supports Tier 1 certification, optical return loss measurement, and Tier 2 troubleshooting across fibre counts up to 24 fibres. Features include automated bidirectional testing, referencing tools, and connector end-face analysis. EXFO says the system is designed to address the increased number of links, connectors, and handling requirements associated with high-density fibre deployments, while reducing the risk of testing errors during large-scale construction projects. For more from EXFO, click here.