Liquid Cooling Technologies Driving Data Centre Efficiency

Extreme weather prompts revision of cooling strategies

Following warnings from scientists that current climate conditions are brewing extreme weather in the months ahead, Aggreko, a British temporary power generation and temperature control company, says it is calling upon data centre managers to revise their cooling strategies ahead of time or face the consequences. Global sea temperatures of 21°C were reported last month - the second highest on record for the month of April - with scientists now pointing to another El Niño warming cycle that could significantly intensify extreme weather. These temperatures are marginally lower the 21.04°C recorded in April 2024 ahead of the last El Niño weather event, which ended up being the fourth warmest year on record for the UK. With a long, hot summer potentially in store, Chris Smith, Head of Temperature Control at Aggreko, says he is urging the data centre sector to review its cooling infrastructure before the heatwave arrives. He suggests, “We need only look back at 2024 to see what El Niño might have in store for us this year. Summer temperatures regularly exceeded 30°C, placing immense pressure on data centre cooling infrastructure and even leading to full-blown equipment failure in worst-case scenarios. “The reality is: current cooling strategies simply aren’t designed to deal with this kind of weather or to operate in these temperature ranges. For this reason, now is the time to start reviewing current cooling infrastructure to assess whether it’s still fit for purpose so the right measures can be brought in ahead of time. “The main thing to look out for is ageing assets, as these are at the greatest risk of lower efficiency, overheating, and failure. Engaging with a specialist temperature control partner can help implement temporary cooling and industrial HVAC solutions to bridge gaps during equipment failures, manage seasonal demand peaks, and provide N+1 redundancy for greater operational resilience.” Data centre cooling under pressure With rack densities on the rise, data centre cooling infrastructure is arguably under greater pressure than ever before, with the cost of outages reportedly becoming more expensive. In the Uptime Institute’s 2026 outage analysis, cooling accounted for 14% of all impactful outages - the second biggest contributor behind power - while one fifth of respondents stated that their most recent outage cost more than $1 million (£745,000). In the face of this challenge, Aggreko believes hybridised packages consisting of battery energy storage systems (BESS) and temporary chillers or cold storage units are becoming an increasingly popular option for the data centre industry. Here, the company notes, the chiller or cold storage unit can provide scalable, supplementary cooling capacity, with the BESS powering the package while enhancing efficiency, reducing costs, minimising environmental impact, and offering near-silent operation versus a standard generator. Chris continues, “While we’ll have to wait and see what the summer has planned for us, now is nonetheless a prime time to re-evaluate cooling strategies and identify where efficiency gains can be made. "Procuring temporary cooling from a third-party specialist not only allows access to the latest, high-efficiency technology, but also opens the door to a number of creative solutions, such a hybridisation, which just aren’t feasible in-house. “While cooling is just one of the challenges that data centre managers have to contend with at the moment, the gains this can deliver, alongside the resilience it provides against the threat of outages, mean that this is more than a worthwhile operational solution.” For more from Aggreko, click here.

Airsys opens global HQ campus in South Carolina

Airsys, a provider of data centre cooling systems, has today opened a new global headquarters campus in Woodruff, South Carolina, USA, to expand manufacturing and engineering capacity for AI and data centre cooling technologies. The 60-acre (24.28-hectare) site will act as the company’s global hub for high-efficiency cooling systems supporting AI, edge computing, and digital infrastructure applications. According to Airsys, the development represents a $60 million (£44 million) investment and is expected to create 215 jobs in the region. Manufacturing operations at the site are scheduled to begin during the first quarter of 2027. The company says the facility will support the production and development of air, liquid, and hybrid cooling technologies designed for high-density computing environments. Facility to support AI cooling demand Yunshui Chen, founder and CEO of Airsys, says, “Today marks a major milestone for Airsys as we establish our global headquarters here in Woodruff, South Carolina. “This investment reflects our commitment to advancing cooling innovation across the entire spectrum of mission-critical infrastructure.” The company states that the new campus has been designed to support growing demand for thermal management systems linked to AI infrastructure and large-scale data centre deployments. Airsys says the site will also support work related to Power Compute Effectiveness (PCE), a framework focused on maximising the proportion of data centre power available for IT workloads after cooling and electrical overheads are accounted for. The project team for the campus included Choate Construction as general contractor and LS3P as architect. According to the company, localising manufacturing and engineering operations in South Carolina is intended to improve supply chain resilience and support North American customers more directly. For more from Airsys, click here.

Veolia, Amazon develop data centre water reuse system

Veolia, a French multinational environmental services company, is working with US technology and e-commerce company Amazon to introduce reclaimed water for cooling at a data centre in Mississippi, USA, as part of efforts to reduce water use and support long-term water resilience. The facility, expected to be operational in 2027, will be the first Amazon data centre in the state to use treated wastewater for cooling processes. The system will convert effluent from nearby treatment plants into water suitable for industrial use. Once fully operational, the project is expected to reuse more than 83 million gallons (313 million litres) of potable water each year, reducing demand on local groundwater and drinking water supplies. Veolia will deploy modular, containerised treatment systems designed for scalable use. The approach allows similar installations to be introduced at other data centres where conditions allow. Turning wastewater into cooling power for data centres The collaboration also includes the use of artificial intelligence to improve water treatment processes. Amazon Web Services (AWS) will support Veolia in developing systems for real-time optimisation, predictive maintenance, and operational analysis. These tools are intended to improve efficiency and reduce resource consumption across water treatment operations. Estelle Brachlianoff, Chief Executive Officer at Veolia, comments, “We are delighted to collaborate with Amazon to secure its water needs in Mississippi while protecting the local community's resources. This is environmental security in action. "By combining Veolia’s water expertise with Amazon’s AI technologies, we’re transforming data centres into engines of innovation for sustainability. This solution builds on our newly launched offering for data centres.” Will Hewes, Global Water Stewardship Lead at Amazon, adds, “Through our collaborative work on AI applied to water treatment, Veolia will be able to further drive innovation and enhance the efficiency of on-site teams, thanks to automated analytics, actionable recommendations, optimised inventory management, and streamlined maintenance. "We’re pleased to join forces with Veolia to advance more sustainable water use strategies while helping it pioneer more efficient water treatment solutions for customers worldwide.” The project, Amazon says, forms part of its wider aim to become water positive across its direct data centre operations by 2030.

Vertiv acquires Strategic Thermal Labs

Vertiv, a global provider of critical digital infrastructure, has acquired Strategic Thermal Labs (STL), a company specialising in liquid-cooling technologies for high-density computing environments. The acquisition is intended to strengthen Vertiv’s engineering capabilities in managing the interaction between server-level liquid cooling and supporting infrastructure, which is becoming increasingly important in AI and high-performance computing deployments. Strategic Thermal Labs brings experience in cold-plate design, server-side liquid cooling, and thermal validation for high-density systems. This is expected to support Vertiv’s ability to simulate real-world operating conditions and improve the integration of thermal and power systems. Acquisition targets high-density cooling challenges As computing workloads become more intensive, thermal management at chip level is playing a greater role in overall system performance and reliability. The addition of STL is aimed at improving design, integration, commissioning, and long-term operation of liquid-cooled environments. Scott Armul, Chief Product and Technology Officer at Vertiv, comments, “As AI and high-performance computing push power densities to unprecedented levels, understanding and solving heat challenges at the chip level becomes critical to system design, performance, and reliability. "STL brings deep expertise and proven capability in addressing some of the industry’s most demanding chip-level density and thermal problems, strengthening Vertiv’s ability to emulate and validate system-level solutions and enabling customers to improve performance and lifecycle outcomes in liquid-cooled environments.” Vertiv states that the acquisition will not change its approach to supporting interoperable infrastructure and the company will continue to work with a range of server and silicon platforms. It adds that the move forms part of its wider strategy to address increasing infrastructure complexity through integrated power, thermal, and lifecycle capabilities. For more from Vertiv, click here.

Carrier launches AquaEdge chiller

Carrier, a manufacturer of HVAC, refrigeration, and fire and security equipment, has introduced the AquaEdge 19MV4 centrifugal chiller, designed to support cooling requirements in high-density AI data centres. The system forms part of the company’s QuantumLeap portfolio and is intended for use in environments where increasing compute density and rising temperatures place pressure on existing cooling infrastructure. The chiller is designed to deliver between 2.1 MW and 3.3 MW of cooling capacity, supporting workloads driven by high-performance GPUs. It is also engineered to operate with chilled-water temperatures of up to 35°C and condensing temperatures up to 55°C, aligning with liquid cooling approaches such as direct-to-chip and rear-door heat exchangers. Designed for high-density cooling environments Carrier states that the system uses a variable-speed centrifugal compressor capable of operating between 10% and 100% load, allowing it to respond to fluctuating AI workloads without frequent cycling. Marti Urpinas, Senior Technical Manager, Vertical Markets EMEA, DC Applied at Carrier, comments, “AI workloads are reshaping data centre specifications, pushing our customers to seek greater thermal headroom without sacrificing power stability. "That sounds like a tall order, but the AquaEdge 19MV4 isn’t a ‘standard’ chiller; it’s a variable-speed centrifugal platform that delivers cooling continuity for high-density racks, even as operators push chilled-water temperatures higher to support direct-to-chip architectures.” The unit is designed to restart within 150 seconds following a power interruption, supporting thermal recovery and reducing the risk of overheating in high-density environments. It also incorporates harmonic filtering to limit electrical distortion and protect associated infrastructure, including uninterruptible power supplies (UPS). Carrier reports that the system can achieve a coefficient of performance (COP) of up to 6.75 and an integrated part load value (IPLV) of 11.4 under AHRI test conditions. The chiller is available with refrigerants including R-1234ze and R-515B, supporting compliance with EU F-Gas regulations. Additionally, noise levels are specified at below 80dBA under defined operating conditions. For more from Carrier, click here.

Data centre cooling in the AI era

During a busy Data Centre World London 2026, Joe from DCNN caught up with Alistair Barnes (pictured above), Global Head of Mechanical Engineering at Colt DCS, to ask how the mechanical engineering discipline is evolving in response to the rapid rise of AI workloads. The two discussed a variety of topics, from the shift towards liquid cooling solutions to the challenge of keeping pace with ever-increasing rack-level power densities. Here, you can read the full Q&A, in which Alistair shares his perspective on where liquid cooling stands today, how Colt DCS's Global Reference Design philosophy shapes its approach to data centre infrastructure, and what he believes remains the industry's toughest unsolved engineering challenge: Liquid cooling, rack densities, and the future of mechanical engineering Joe: Hi, Alistair! So, how is mechanical engineering keeping pace with the shift to higher-density AI workloads? Alistair: Mechanical engineers are keeping pace with higher‑density AI workloads by moving beyond traditional air‑only cooling and rethinking the entire thermal design stack. Instead of simply supplying cold air, they now operate more like system integrators, collaborating closely with IT and facilities teams to cool heat‑intensive components such as GPUs. This includes integrating direct‑to‑chip cold plates, liquid distribution loops, and hybrid cooling systems capable of managing the extreme heat generated by modern AI hardware. Joe: In your opinion, is liquid cooling now a mainstream solution or still a specialist one? Alistair: Liquid cooling is becoming increasingly mainstream, but the industry isn’t yet at a point where it can rely on liquid alone, as air still plays an important role in most deployments. Operators adopting Global Reference Designs (GRDs) now include liquid‑cooling options to support high‑density AI workloads that air alone can’t efficiently manage. As a result, many still use hybrid setups that combine air cooling with liquid where needed. Closed‑loop systems, such as liquid‑to‑chip, circulate coolant in a sealed loop, ensuring near‑zero wastewater and making them practical and sustainable. Joe: Where does mechanical engineering sit in Colt DCS's broader data centre design philosophy? Alistair: Mechanical engineering sits at the core of our design philosophy, supporting our commitment to delivering scalable, efficient, and sustainable data centre solutions. We adopt a GRD, a standardised and repeatable blueprint that accelerates deployment, optimises cost, and maintains consistent quality while remaining flexible enough to meet local requirements. Mechanical engineers play a key role in shaping the GRD, ensuring mission-critical cooling infrastructure and integrating new technologies across sites to support future growth and reliable operations. Joe: What's the hardest engineering problem the industry hasn't solved yet? Alistair: The hardest engineering problem the industry hasn’t solved is keeping pace with the accelerating rise in rack‑level power densities. Liquid cooling is advancing quickly and can manage far more heat than ever before, but single‑rack densities approaching 2MW and beyond are increasing faster than these solutions can be deployed at scale. The real challenge is delivering this capacity sustainably - balancing cooling performance, energy efficiency, and power availability - all while accelerating build timelines to keep up with customer demand. For more from Colt DCS, click here.

ZutaCore brings two-phase cooling to PCIe GPUs

ZutaCore, a developer of liquid cooling technology, has announced that its OmniTherm cold plate now enables waterless, two-phase cooling for manufacturers building servers with the NVIDIA RTX PRO 6000 Blackwell Server Edition GPUs in a single-slot PCIe form factor, supporting full-power operation in standard enterprise and AI cloud server environments. As AI inference expands across enterprise and cloud environments, PCIe GPU servers have become a common platform due to their relative ease of deployment, scalability, and compatibility with existing infrastructure. However, as GPU power consumption rises, air cooling can become a limiting factor, restricting density, driving up fan power, and increasing the risk of thermal throttling during sustained workloads. The company says OmniTherm addresses this by enabling a transition to two-phase liquid cooling without introducing water inside the server. The single-slot design allows operators to increase accelerator density in standard server architectures while capturing heat into a liquid loop, reducing reliance on high fan speeds that can create excessive noise, waste power, and cause difficult operating conditions in the data centre. "Enterprise and cloud operators want the flexibility of PCIe GPUs, but they also need density and sustained performance as power levels rise," comments My D. Truong, CTO of ZutaCore. "OmniTherm delivers waterless, two-phase cooling in a single-slot form factor, helping data centres increase accelerator density while maintaining stable thermals for 24/7 AI workloads." Two-phase cooling for dynamic AI workloads Production AI workloads - particularly inference - are rarely steady, fluctuating constantly and creating thermal swings that can affect performance and reliability. ZutaCore says its two-phase approach is designed to respond to changing workloads, helping data centres maintain predictable performance under dynamic utilisation. As racks move into higher power levels, the operational cost of air cooling also rises, with increased fan energy consumption and growing acoustic and facility pressures. OmniTherm uses a sealed, non-conductive dielectric fluid system that captures heat without requiring facility water in the server, reducing cooling overhead and providing a path to scaling PCIe-based AI deployments. Alongside this announcement, ZutaCore has also introduced HyperCool Cloud, a cloud-native operations platform designed to help data centres manage liquid cooling infrastructure. The platform, the company says, provides "near-real-time" CDU telemetry, fleet-level monitoring, and alarm-to-resolution workflows, helping operators manage service response and uptime as deployments scale across sites and fleets. For more from ZutaCore, click here.

Tecnair launches new CDUs for data centre cooling

Tecnair, a manufacturer of close control air conditioning units for data centres and a Panasonic company, has introduced a new range of coolant distribution units (CDUs) designed for high-density artificial intelligence and high-performance computing (HPC) data centres. The systems were presented at Data Centre World London 2026, held on 4–5 March, and are intended to support liquid cooling deployments as computing densities increase. Rising AI workloads are pushing rack densities beyond levels typically supported by traditional air cooling. The CDU range has been developed to support liquid cooling architectures, including direct-to-chip and immersion cooling, helping data centre operators manage higher thermal loads. The units are designed for environments where rack densities regularly exceed 50kW and are approaching 100kW. Liquid cooling for high-density infrastructure The CDU range is available in capacities of 400kW and 800kW and can be deployed across a range of environments, from edge facilities to hyperscale data centres. The systems include redundant components such as pumps, power supplies, and sensors to support continuous operation in mission-critical environments. A failover capability is also included to maintain cooling during maintenance or component failure. According to Tecnair, the units can achieve partial power usage effectiveness (pPUE) values as low as 1.02 through the use of free-cooling coils and micro-channel heat exchanger technology. Monitoring functions are integrated through Modbus building management system connectivity, enabling real-time visibility of parameters including temperature, pressure, flow rate, water level, and leak detection. The CDU range is designed to integrate with Panasonic cooling systems, including free-cooling chillers using R1234ze refrigerant with a low global warming potential. These chillers use outside air temperatures, down to -10°C, to generate chilled water through a free-cooling function, supporting improved energy efficiency in suitable climates. For more from Tecnair, click here.

Crestchic unveils 600kW liquid-cooled loadbank

Crestchic, a UK manufacturer of loadbanks and transformers for testing power systems and data centres, has launched its new 600kW Liquid Cooled Loadbank at Data Centre World London 2026, aimed at supporting commissioning in the growing liquid-cooled data centre market. As rack power densities increase, operators are increasingly adopting liquid cooling to manage higher thermal loads. Crestchic says the new system has been designed to provide accurate thermal validation and precision electrical testing for liquid-cooled infrastructure. The 600kW loadbank delivers up to 648kW at 415V and features stable ΔT thermal control to ±0.5°C, enabling repeatable testing during commissioning. Temperature accuracy is maintained regardless of flow variation, while built-in protections cover flow, pressure, overload, underload, and thermal shock. Designed for liquid-cooled data centre commissioning The unit uses a single-vessel architecture, reducing footprint compared with multi-vessel systems at similar power levels. This compact design makes it easier to position in plant rooms and simplifies transport and handling. The platform includes a stackable structure, flush-mounted connections, heavy-duty castors, and dual-side forklift pockets, allowing two units to be transported within a standard-height ISO shipping container. The system integrates with Crestchic’s VCS software, providing live monitoring of supply and hydraulic data, real-time load profiling, and the ability to cluster up to 240 load banks for hybrid air- and liquid-cooled testing. Paul Brickman, Commercial Director at Crestchic, says, “The move towards liquid cooling is accelerating as rack densities increase, particularly with AI and high-performance computing workloads. “Our new 600kW Liquid Cooled Loadbank has been designed from the ground up to serve this market, giving commissioning engineers the precision, reliability, and control they need to bring critical infrastructure online with confidence." The 600kW Liquid Cooled Loadbank is available for sale or rental through Crestchic’s global network. For more from Crestchic, click here.

Johnson Controls to acquire Alloy Enterprises

Johnson Controls, a global provider of smart building technologies, has signed an agreement to acquire Alloy Enterprises, a developer of liquid cooling technology for high performance data centres and industrial facilities. Founded in 2020 and based in Boston, USA, Alloy Enterprises develops direct liquid cooling components designed to improve heat removal and reduce pressure drop in cooling loops. The company states the approach can improve thermal efficiency by up to 35% while lowering cooling system energy use. The acquisition is intended to expand Johnson Controls’ data centre cooling portfolio, which already includes chillers, coolant distribution units, and waste heat recovery systems. Liquid cooling capability expansion Johnson Controls says Alloy’s manufacturing and materials engineering capabilities will complement its existing cooling equipment, including chillers and liquid cooling distribution platforms. The technology is designed to support cooling of GPUs, CPUs, memory, and network interfaces in high density computing environments. Lei Schlitz, President, Global Products & Solutions at Johnson Controls, says, “This acquisition is about enabling our customers to stay ahead of fast-changing compute demands by adding another core technology that enables us to optimise the overall thermal management architecture of a data centre. "It will also strengthen our core technology capabilities that can scale across the Johnson Controls portfolio and reinforces our long-term commitment to lead more broadly in advanced thermal management solutions for mission critical applications.” Alison Forsyth, co-founder and CEO of Alloy Enterprises, says, “We’ll continue to work closely to solve the industry's most urgent challenges in data centres and other mission-critical environments. "We look forward to this new chapter and continuing to scale with one of the world's most respected and experienced leaders in thermal management innovation.” The transaction is expected to complete in the company’s fiscal third quarter, subject to regulatory approvals. Financial terms were not disclosed. For more from Johnson Controls, click here.