Paving the way for efficient high-density AI at 400G & 800G

Author: Joe Peck

AI workloads are reshaping the data centre. As back-end traffic scales and racks densify, the interconnect choices you make today will determine the performance, efficiency, and scalability of tomorrow’s AI infrastructure.

In this fast, focused 30-minute live tech talk, Siemon’s experts will share a practical, cabling-led view to help you plan smarter and deploy faster.

Drawing on field experience and expectations from large-scale AI deployments, the session will give you clear context and actionable guidance before your next design, upgrade, or AI back-end project begins.

Discover:

• AI market overview & nomenclature: A clear look at scale-up vs scale-out networks and where each fit in AI planning.

• Reference designs & deployment sizes: Common GPU pod approaches (including air-cooled and liquid-to-chip) and what they mean for density and footprint.

• AI network connection points: Critical interconnect considerations for high-performance AI back-end networks.

• AI network cabling considerations: What to evaluate when selecting cables for demanding 400G/800G workloads.

• Cabling options that improve efficiency: Real-world examples of how architecture choices affect deployment efficiency, including a 1024-GPU comparison.

Walk away with:

• A clear understanding of high-density interconnect options.

• Insight into proven deployment strategies and the trade-offs that matter.

• Confidence to make informed decisions that scale with AI workloads.

Speaker: Ryan Harris, Director, Systems Engineering (High-Speed Interconnect), Siemon
Date: Thursday, 2 October 2025
Time: 2:00–2:30 PM BST | 3:00–3:30 PM CET

This is the must-see tech talk for anyone planning, designing, or deploying high-density AI data centres. Don’t miss your chance to get the insight that can accelerate your next project and keep your infrastructure ready for the demands ahead.

For more from Siemon, click here.