Navitas, Microchip develop 800V reference design
Author: Joe Peck
Navitas Semiconductor, a US maker of gallium nitride and silicon carbide power chips for AI data centres, and semiconductor manufacturer Microchip Technology have collaborated on an 800V DC-to-6V DC reference design for AI data centre rack power applications.
As AI data centres scale to support high-power GPU clusters, the industry is moving towards 800V DC rack power architectures to improve distribution efficiency, increase power density, and support higher-power server designs.
The reference design combines Microchip’s digital power control and security technologies with Navitas’s gallium nitride (GaN) power devices. The companies say it provides developers with a route to implementing power conversion aligned with the Open Compute Project (OCP) 800V DC standard.
The reference platform includes hardware, software, and design documentation intended to support the development of 800V DC power conversion systems.
Joe Thomsen, Corporate Vice President of Microchip’s Digital Signal Controller Business Unit, says, “AI infrastructure optimisation is driving one of the most significant power architecture transitions the data centre industry has experienced in decades.
“As the ecosystem moves towards higher-voltage rack power systems, developers need proven building blocks that help reduce design risk and accelerate innovation.
“Our collaboration with Navitas brings together complementary technologies to help customers navigate this transition and bring next-generation power solutions to market more quickly.”
Direct 800V-to-6V conversion
The reference platform uses Microchip’s digital signal controllers and hardware security technology alongside Navitas’s GaN power devices. The primary side uses 16 GaN FETs in a stacked half-bridge topology. The dual-side-cooled package is designed to reduce thermal resistance, supporting higher continuous power operation.
The power delivery board targets peak efficiency of up to 96% at full load, with a switching frequency of 1MHz and a power density of 2,100W/in³. The low-profile design is intended to enable close integration with GPU boards, supporting transient performance and power distribution efficiency.
The design uses direct conversion from 800V DC to 6V DC, combining the 800V DC-to-50V DC and 50V DC-to-6V DC conversion stages into a single converter. The reference design also incorporates Microchip’s hardware-based security technology to support authentication and protection within power infrastructure.
The technology supports functions including secure boot, Message Authentication Code generation, trusted firmware updates, key management protocols including Transport Layer Security (TLS), and other root-of-trust operations.
It will be showcased at Microchip’s OCP Event in San Jose, California, USA, from 12–15 October 2026, and a reference board, software, and supporting documentation will also be provided to help developers evaluate 800V DC power conversion systems for AI data centre applications.
