Digi International, a global provider of Internet of Things
(IoT) connectivity products and services, has announced that it is highlighting
its Digi XBee3 series of smart edge IoT modules and modems, with a particular
emphasis on the Digi XBee3 Cellular with NB-IoT, at electronica 2018 in Munich,
Digi is showcasing its solutions with several demonstrations of the latest embedded technology and is also sharing its expertise by leading multiple educational sessions.
Electronica is taking place at the Messe München Exhibition Center from November 13-16, 2018. Digi is exhibiting in Hall B5 at Booth 263.
The Digi XBee3 series is designed to support IoT innovation and computing capability at the network edge. Digi XBee3 provides MicroPython programmability and dual-mode radios, with the ability to upgrade via software to Bluetooth LE, enabling local device connectivity from a smartphone or tablet.
Digi XBee3 adopts a modular approach to IoT connectivity that includes options for Zigbee, Wi-Fi, or cellular, including LTE-M and NB-IoT. Digi XBee3 enables innovative IoT solutions that can be more quickly developed, prototyped and mass-produced for optimal return on investment, says its creator.
These solutions can be deployed, provisioned and monitored with Digi XCTU and Digi Remote Manager (DRM), Digi’s centralised, secure device management platform.
In addition to providing insight into device and network health, DRM automates updates, accesses data directly from the edge and integrates data into open APIs to provide users with deeper insights.
Additionally, Digi is previewing its Digi ConnectCore 8X
system-on-modules (SOMs) and SBCs. Digi is an NXP early access partner, and the
small module will utilise the NXP i.MX 8X processor family based on ARM Cortex-A35
and Cortex-M4F cores.
“When people come to electronica, they expect to see not
just new technology, but how it can help them solve their business challenges,”
says Chris Bowen, vice president, EMEA, at Digi International. “Digi addresses
connection and networking needs with a full range of embedded hardware options,
software specifically developed to optimize IoT deployments and expert services
to ensure customer success. Digi is not just connecting the things in the IoT,
we’re offering data, insights and management tools to maximize performance and
drive business value.”
- Remote IoT Connectivity with Digi XBee3
Cellular: This demonstration will showcase remote device management between
a Digi XBee3 Cellular device and the cloud-based Digi Remote Manager by
remotely monitoring and controlling devices located in multiple locations
directly from the trade show floor.
- Digi XBee3 End-to-End IoT Networking: Digi
will present the latest advancements in the Digi XBee3 platform, including
multi-protocol support (Zigbee, CAT-1, LTE-M, NB-IoT + Bluetooth LE), with
an IoT networking solution composed of Digi XBee3 modules, Digi XBee industrial
gateways and network/device management tools. These updates enable new use
cases for improved installation, local control diagnostics and configuration.
The network and device management element will use a new XCTU® Mobile
application for the Digi XBee configuration via a phone or tablet.
- SteadyServ iKeg: This application
demonstration will show the SteadyServ iKeg using sensors to measure keg
volume, analyze the data locally with a Digi ConnectPort gateway, then send the
analysis into the cloud over a Zigbee connection. The iKeg application presents
the cloud-based information to bar managers to help accurately inventory and
proactively order more when beer runs low.
- Selecting Cellular LPWAN Technology for the
IoT: Presented by Mark Tekippe, Digi International Director of Product
Management, Embedded and RF, on Wednesday, November 14. As part of the IoT
Track, this session will address selecting the best connectivity technology for
low-power, low-bandwidth requirements in the IoT, touching on LTE Cat 1, LTE-M,
NB-IoT and more.
- What is Edge Compute?: Presented by
Andreas Burghart, Digi International Solution Sales Engineer, on Thursday,
November 15. As part of the Machine Learning Track, this session dives into how
bringing intelligence to the edge demands a different way of thinking about
existing IT infrastructures. Touchstones include extending compute capabilities
intelligently, opening up new opportunities and revenue streams with more
compute power, and improving time to market.
- Yocto Project Linux as a Platform for
Embedded Systems Design: Presented by Alex Gonzalez, Supervisor, Software
Engineering; Digi International, on Thursday, November 15. As part of the
software track, this session covers a wide-range of issues when selecting an
operating system for an embedded system including acquisition cost, source code
availability, and its broad architecture support. All these factors lead to a
significantly improved time-to-market and a reduction in platform design risk
Co-exhibitors and Partner Participation
As well as at its own booth, Digi is exhibiting solutions
and will be showcased throughout the venue with partners including Mouser (Hall
C3, Booth 550), Digi-Key Electronics (Hall B5, Booth 165), Atlantik (Hall C4,
Booth 222), CODICO (Hall C4, Booth 402), Avnet Silica (Hall C5, Booth 101) and
Arrow (Hall C4, Booth 412).
- In-booth info
- Mouser will include Digi’s XBee XGI Industrial
Gateways and Digi XBee & Silicon Labs Giant Gecko Kit in its “Future
Cities” virtual reality demonstration in both the Digital Twinning and Smarter
- Atlantik will feature a ConnectCore 8X in their
- CODICO will display Digi TransPort and NB-IoT
modules in its booth.